rajakannan
06-27 08:41 AM
Dude, From your previous posts looks like you have already filed and got your receipt notice.
http://immigrationvoice.org/forum/showthread.php?p=87755#post87755
http://immigrationvoice.org/forum/showthread.php?p=80880#post80880
Well, this is not a good idea ... and obviously every one is as anxious as others to get their papers filed on time. This does not make sense at all. I read your posting history and notice your posts with GC approval and also about receipt notice for spouse.
What is goin on with you ?
you should probably correct ur sentence "... and obviously every one is as anxious as others to get their papers (fedexed) filed on time, fedexing it will not alone guarantee your filing.
http://immigrationvoice.org/forum/showthread.php?p=87755#post87755
http://immigrationvoice.org/forum/showthread.php?p=80880#post80880
Well, this is not a good idea ... and obviously every one is as anxious as others to get their papers filed on time. This does not make sense at all. I read your posting history and notice your posts with GC approval and also about receipt notice for spouse.
What is goin on with you ?
you should probably correct ur sentence "... and obviously every one is as anxious as others to get their papers (fedexed) filed on time, fedexing it will not alone guarantee your filing.
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arindam
04-02 12:00 PM
Send both faxes.
.soulty
02-03 06:22 AM
placed my vote, all entry's were awesome, well done everyone. :smirk:
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stuckinretro
02-17 05:43 PM
Mine is a CSC to NSC xfer case. FP done in Jan'08 Received HLUD on 02/09 and SLUd on 02/10 for me and my family's 485s. Nothing after that.
HLUD was
Application Type: I485 , APPLICATION TO REGISTER PERMANENT RESIDENCE OR TO ADJUST STATUS
Current Status: This case is now pending at the office to which it was transferred.
The I485 APPLICATION TO REGISTER PERMANENT RESIDENCE OR TO ADJUST STATUS was transferred and is now pending standard processing at a USCIS office.
HLUD was
Application Type: I485 , APPLICATION TO REGISTER PERMANENT RESIDENCE OR TO ADJUST STATUS
Current Status: This case is now pending at the office to which it was transferred.
The I485 APPLICATION TO REGISTER PERMANENT RESIDENCE OR TO ADJUST STATUS was transferred and is now pending standard processing at a USCIS office.
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paskal
08-31 05:29 PM
i meant to ask this earlier
if you are unable to make it to DC- and if it's for any reason that we can help with at all- please let me know. you can pm if you want.
if you are unable to make it to DC- and if it's for any reason that we can help with at all- please let me know. you can pm if you want.
diptam
08-15 12:38 PM
Folks who got Rn is no more interested in Voting or talking about RN.
They are opening threads for FP Notice etc - they are not looking backwards at us - What are you planning to do ?
- My lawyer wants to refile (with no addional lawyer fees). Does it make any sense to re-file?
- Is there a vote somewhere that shows how many july 2 files received receipt notices?
They are opening threads for FP Notice etc - they are not looking backwards at us - What are you planning to do ?
- My lawyer wants to refile (with no addional lawyer fees). Does it make any sense to re-file?
- Is there a vote somewhere that shows how many july 2 files received receipt notices?
more...
Libra
07-17 10:21 AM
God, within one month they processed only 9 days applications, mine is sep 20 and i dont know when my number will come. Damn, they can process 25k applications in 2 days but they cant process 9 days I-140 apps in one month. so frustrating, my h1 will expire on sep 29th 2007:mad:
September 14, 2006
September 14, 2006
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coopheal
04-18 02:43 PM
'cause almost all India EB3 visa numbers for this year are gone.
Where did you get information about almost all EB3 GCs for India are gone for the year.
Where did you get information about almost all EB3 GCs for India are gone for the year.
more...
bujjigadu123
02-21 01:34 AM
That is what surprising to me. I searched for similar experience in all the forums but could not get any matching results. This is what bothering me. Why me (only)???
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viv24
05-26 12:13 AM
My problem is that, i have approved h1b, went for stamping to canada, got stuck there for 60 days under 221g, the consulate has still my stamping pending,meanwhile to protect my job i used my AP.
my questions, do i have use ead or can stay in h1b when the stamping is pending.
my questions, do i have use ead or can stay in h1b when the stamping is pending.
more...
gcseeker2002
08-25 05:56 AM
By law Employer is required to pay for your labor. You cannot pay for your labor application. Employer can ask you to pay for your I140 which cost around 400 but if you go for premium processing you can pay 1000 extra. There is no other cost involved. To port your date your lawyer sends a letter to USCIS requesting them to consider your EB2 I140 instead of your Eb3 140 which results in your successfuly porting with your priority date still being maintained from old labor
Thanks for the info. But is it really true that by law employer is required to pay for labor ? I think it used to be that only h1b expenses are required to be paid by employer.
Also, most companies ask for agreements to repay them if we dont stay with them for few years for filing greencard . Is these agreements legal if they ask to repay labor fees ?
Thanks for the info. But is it really true that by law employer is required to pay for labor ? I think it used to be that only h1b expenses are required to be paid by employer.
Also, most companies ask for agreements to repay them if we dont stay with them for few years for filing greencard . Is these agreements legal if they ask to repay labor fees ?
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mhathi
07-17 10:33 AM
FBI background check delay is the only reason why visa numbers are wasted every year. Pending I485 cannot be adjudicated and allocated visa numbers due to pending security checks. At the same time these pending I485s also don't let the visa bulletin dates move forward fast enough. Just wait and see how this problem is going to get worse in the coming years.
Retrogression is a serious problem right now due to quotas and country quotas. But backlogged FBI checks will make it worse for thousands of people.
I agree with everybody on this thread. I agree this solution ( if any) will be a band aid. I also agree the band-aid is needed to prevent the wound from becoming fetid. I agree this may exacerbate problems.
For all these reasons, it is imperative we do not stop after this anouncement. Our long term goal has to be retrogression relief in one form or the other, including all or some of recapture of unused visas, increase in annual quota, resolution of the FBI name chack black hole, and more that able persons in IV can doubtless think of better than yours truly.
I, for one, am going to be a member of IV long after this anouncement.
Retrogression is a serious problem right now due to quotas and country quotas. But backlogged FBI checks will make it worse for thousands of people.
I agree with everybody on this thread. I agree this solution ( if any) will be a band aid. I also agree the band-aid is needed to prevent the wound from becoming fetid. I agree this may exacerbate problems.
For all these reasons, it is imperative we do not stop after this anouncement. Our long term goal has to be retrogression relief in one form or the other, including all or some of recapture of unused visas, increase in annual quota, resolution of the FBI name chack black hole, and more that able persons in IV can doubtless think of better than yours truly.
I, for one, am going to be a member of IV long after this anouncement.
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RNGC
04-24 03:16 PM
Sandy_77
Oh man...very sad for you.....this should not be happenning
Where are you ? If in India, go to CNN-IBN, NDTV or some news channel and get your story out....You are not doing any crime, you are just telling your side of the story.... I just sent a PM to pappu(admin) to see how IV can help people stuck in India
Oh man...very sad for you.....this should not be happenning
Where are you ? If in India, go to CNN-IBN, NDTV or some news channel and get your story out....You are not doing any crime, you are just telling your side of the story.... I just sent a PM to pappu(admin) to see how IV can help people stuck in India
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zilmax007
07-27 05:32 PM
An Indian man walks into a bank in New York City and asks for the loan officer. He tells the loan officer that he is going to India on business for two weeks and needs to borrow $5,000.The bank officer tells him that the bank will need some form of security for the loan, so the Indian man hands over the keys to a new Ferrari parked on the street in front of the bank. He produces the title and everything checks out. The loan officer agrees to accept the car as collateral for the loan.The bank's president and its officers all enjoy a good laugh at the Indian for using a $250,000 Ferrari as collateral against a $5,000 loan. An employee of the bank then drives the Ferrari into the bank's underground garage and parks it there.Two weeks later, the Indian returns, repays the $5,000 and the interest, which comes to $15.41.The loan officer says, "Sir, we are very happy to have had your business, and this transaction has worked out very nicely,but we are a little puzzled. While you were away, we checked you out and found that you are a multi millionaire. What puzzles us is, why would you bother to borrow "$5,000".The Indian replies: "Where else in New York City can I park my car for two weeks for only $15.41 and expect it to be there when I return".
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ramreddy
01-31 05:08 AM
Ms Su of TVU....why would someone stoop so low and looks like she became a convenient scapegoat for the students ..? not sure what'd you think. She has a Phd from UC Berkley and a patent on her name ....several publications.
I dug up her resume...
Dr. Susan Xiao-Ping Su
President of Tri-Valley University
Tri-Valley University TVU (http://trivalleyuniversity.org)
E-mail: ssu@trivalleyuniversity.org, su123@sbcglobal.net
EDUCATION
Ph .D. Department of Mechanical Engineering, University of California at Berkeley, 2001.
Major: Design; Minor I: Microscale Heat Transfer; Minor II: Integrated Circuit Technology.
Dissertation: Compliant Microleverage Mechanism Design for MEMS Application
Dissertation Advisors: Prof. Alice M. Agogino; Prof. Tsu-Jae King, Prof. Dennise K. Lieu
M. S. Department of Mechanical and Aeronautical Engineering, University of California at Davis, 1997. Major: Design
Thesis: Computer-Aided Kinematic and Dynamic Analysis of Spatial Mechanisms
Thesis Advisors: Prof. Harry H. Cheng; Prof. Bahram Ravani; Prof. An T. Yang (Emeritus)
B. S. Department of Engineering Mechanics, Tsinghua University, China, 1991.
Major Field of Study: Fluid Mechanics
WORK EXPERIENCE
1. President and Founder, Semiconductor System Integration, Pleasanton, 2003-present
� Consultant for Phosistor Technology, Pleasanton, on Semiconductor Device Fabrication, Development of photonic component (laser and OPM) process, Oxford Plasmalab DRIE and ICP etching of SiO2 for Optical MEMS devices.
� Consultant for California Micro Device on Chip-Scale-Packaging strengthen mechanism;
� Consultant for NASA on nano chemical sensor fabrication.
� High-density Magnetic Random Access Memory Development
2. Lecturer, HerGuan University, Sunnyvale, 2007
EE537 Analog IC Design, EE515 & 516 VLSI I & II
3. Lecturer, San Jose State University, San Jose, CA, Fall 2004-2006
EE178 Digital System Design with FPGA, ME 101 Dynamic
4. Lecturer, San Francisco State University, San Francisco, CA, 2004-2005;
ENGR 890 Design of MEMS; Design of CMOS Memory Circuit
ENGR 356 Computer Architecture; ENGR378 Digital System Design with Verilog.
5. Lecturer, International Technological University, Santa Clara, CA, 2004-2007
EEN967 Analog IC Design; EE 519 CMOS Memory Circuit Design; EE 511 VlSI I, II;
EEN 923 & 910 Semiconductor Physics & Devices; EEN 918 IC Fabrication Technology.
6. Lecturer, Northwestern Polytechnic University, Fremont, CA, 9/2002 -2004
EE 507 Analog IC Design; EE 520 CMOS Memory Circuit Design;
EE 506 VLSI II; EE 624 IC Fabrication Technology; EE 581 MEMS/NEMS Design;
Developing MEMS and nanotechnology concentration area curriculum.
7. Member of Technical Staff, Project manager, PicoNetics Inc., Fremont, 9/2000-9/2002.
� 256K 100MHz (TSMC 0.25m) and 4M 200MHz SRAM design (0.13m G logic process); RLC circuit for on-chip sin wave generation, sense amplifier fro SRAM, DRAM, Bandgap reference, voltage regulator, PLL circuit design, standard cell library design.
� Supervision of two layout engineers for a 256K SRAM circuit including all technical file set-up, layout optimization for minimum coupling and RC delay, Dracula LVS and Arcadia extraction, LVS and Extraction tools evaluation and memory compliers; UMC and TSMC 0.25, 0.18, 0.15 and 0.13 m process evaluation for SRAM.
8. Graduate Researcher, Berkeley Sensor and Actuator Center (BSAC), and Berkeley Expert Technology System Lab (BEST), U. C. Berkeley, 1996-2000.
� Design, fabrication and testing of a resonant accelerometer (RXL) with on-chip amplifier and two-stage leverage mechanism by the SOI-MEMS integrated process.
� Compliant micro-leverage mechanism design and analysis, FEM analysis and simulation with ABAQUS and SUGAR; Design of the mechanism for force and displacement amplification in other MEMS devices including a micro-valve, an electrostatic actuator and the suspension of the disk drive.
9. Internship, Lawrence Berkeley National Lab, EETD, 6/1999-12/1999.
� Optics programming; SEM and TEM measurements of glass samples.
10. Graduate Researcher, Integrated Engineering and Mechatronics Lab, Dept. of Mechanical and Aeronautical Engineering, UC Davis, 1994-1996
� With Ch program, analysis of velocity and acceleration for 32 spatial mechanisms (4-bar, 5-bar, 6-bar and 7-bar); force and torque analysis of RCCC & RCRCR mechanisms;
� Designed a data acquisition system for PAS machine by communication of an AT-MIO-16F board in Labview.
GRADUATE THESIS ADVISING:
� Yaosong Tao, International Technological University, Ph.D. Thesis: RF MEMS Components for Communication Systems, 2004.
� Leo Huang, Northwestern Polytechnic University, M.S. Thesis, Contacting Printing Lithography for Polymeric Organic Light-Emitting Diode, 2005;
� Sam Shi, International Technological University, M.S. Thesis, A 8-bit Energy Recover Adder, 2005;
� Parthiv Pandya, International Technological University, M.S. Thesis: MRAM Core Cell Design and Optimization, 2004;
� Paisit Sriprataks, International Technological University, M.S. Thesis: MRAM Sensing Circuit Design, 2004;
� Balajee Premraj, International Technological University, M.S. Thesis: Design of an 8M MRAM, 2004;
� Raul Gali, Northwestern Polytechnic University, M.S. Thesis: Signal Process Circuit Design for a Resonant Accelerometer, 2003;
AWARDS and HONORS
� John H. Latoures Scholarship, Mechanical Engineering Department,U.C. Berkeley, 2001.
� Lankershim Awards, U.C. Berkeley, 2000
� National Science Foundation (NSF) Graduate Research Fellowship (1996-1999);
� American Associated University Woman (AAUW) Selected Professional Fellowship ,1995;
� University Fee Grant, UC Davis, 1994.
PUBLICATIONS
1. S. X. P. Su, H. S. Yang, Alice M Agogino, Resonant Accelerometer with a Two-Stage Microleverage Mechanism Fabricated by SOI-MEMS Technology, IEEE Sensors Journal, Vol.5, No.6 December 2005, p.1214-1223
2. An Sang Hou, Susan X. P. Su, Design of a Capacitive-Sensor Signal Processing System with High Accuracy and Short Conversion Time, Sensors and Actuators A: Physical, Volume 119, Issue 1, 28 March 2005, P.113-119
3. X-P S. Su, H. S. Yang, Analytical Modeling and FEM Simulation of Single-Stage Microleverage Mechanism, International Journal of Mechanical Sciences 44, 2217-2238, 2002.
4. X-P. S. Su, H. S. Yang, Two-Stage Microleverage Mechanism Optimization in a Resonant Accelerometer, Structural and Multidisciplinary Optimization 22, 328-336, 2002.
5. X-P S. Su, H. S. Yang, Design of Compliant Microleverage Mechanism, Sensors and Actuators, A 87 146-156, 2001.
6. X-P S. Su, H. S. Yang, Single-Stage Microleverage Mechanism Optimization in a Resonant Accelerometer, Structural and Multidisciplinary Optimization 21, 246-252, 2001
7. H. S. Yang, X-P S. Su and B. Bai, Strain Analysis in Uniaxial Tensile and Compression Testing of Anisotropic Materials, International Journal of Mechanical Sciences 42 (2000) 2395-2415.
PATENTS
1. Susan X. P. Su, �A Folded-MTJ MRAM Cell� U.S. Patent No. US60/994941, 2007
I dug up her resume...
Dr. Susan Xiao-Ping Su
President of Tri-Valley University
Tri-Valley University TVU (http://trivalleyuniversity.org)
E-mail: ssu@trivalleyuniversity.org, su123@sbcglobal.net
EDUCATION
Ph .D. Department of Mechanical Engineering, University of California at Berkeley, 2001.
Major: Design; Minor I: Microscale Heat Transfer; Minor II: Integrated Circuit Technology.
Dissertation: Compliant Microleverage Mechanism Design for MEMS Application
Dissertation Advisors: Prof. Alice M. Agogino; Prof. Tsu-Jae King, Prof. Dennise K. Lieu
M. S. Department of Mechanical and Aeronautical Engineering, University of California at Davis, 1997. Major: Design
Thesis: Computer-Aided Kinematic and Dynamic Analysis of Spatial Mechanisms
Thesis Advisors: Prof. Harry H. Cheng; Prof. Bahram Ravani; Prof. An T. Yang (Emeritus)
B. S. Department of Engineering Mechanics, Tsinghua University, China, 1991.
Major Field of Study: Fluid Mechanics
WORK EXPERIENCE
1. President and Founder, Semiconductor System Integration, Pleasanton, 2003-present
� Consultant for Phosistor Technology, Pleasanton, on Semiconductor Device Fabrication, Development of photonic component (laser and OPM) process, Oxford Plasmalab DRIE and ICP etching of SiO2 for Optical MEMS devices.
� Consultant for California Micro Device on Chip-Scale-Packaging strengthen mechanism;
� Consultant for NASA on nano chemical sensor fabrication.
� High-density Magnetic Random Access Memory Development
2. Lecturer, HerGuan University, Sunnyvale, 2007
EE537 Analog IC Design, EE515 & 516 VLSI I & II
3. Lecturer, San Jose State University, San Jose, CA, Fall 2004-2006
EE178 Digital System Design with FPGA, ME 101 Dynamic
4. Lecturer, San Francisco State University, San Francisco, CA, 2004-2005;
ENGR 890 Design of MEMS; Design of CMOS Memory Circuit
ENGR 356 Computer Architecture; ENGR378 Digital System Design with Verilog.
5. Lecturer, International Technological University, Santa Clara, CA, 2004-2007
EEN967 Analog IC Design; EE 519 CMOS Memory Circuit Design; EE 511 VlSI I, II;
EEN 923 & 910 Semiconductor Physics & Devices; EEN 918 IC Fabrication Technology.
6. Lecturer, Northwestern Polytechnic University, Fremont, CA, 9/2002 -2004
EE 507 Analog IC Design; EE 520 CMOS Memory Circuit Design;
EE 506 VLSI II; EE 624 IC Fabrication Technology; EE 581 MEMS/NEMS Design;
Developing MEMS and nanotechnology concentration area curriculum.
7. Member of Technical Staff, Project manager, PicoNetics Inc., Fremont, 9/2000-9/2002.
� 256K 100MHz (TSMC 0.25m) and 4M 200MHz SRAM design (0.13m G logic process); RLC circuit for on-chip sin wave generation, sense amplifier fro SRAM, DRAM, Bandgap reference, voltage regulator, PLL circuit design, standard cell library design.
� Supervision of two layout engineers for a 256K SRAM circuit including all technical file set-up, layout optimization for minimum coupling and RC delay, Dracula LVS and Arcadia extraction, LVS and Extraction tools evaluation and memory compliers; UMC and TSMC 0.25, 0.18, 0.15 and 0.13 m process evaluation for SRAM.
8. Graduate Researcher, Berkeley Sensor and Actuator Center (BSAC), and Berkeley Expert Technology System Lab (BEST), U. C. Berkeley, 1996-2000.
� Design, fabrication and testing of a resonant accelerometer (RXL) with on-chip amplifier and two-stage leverage mechanism by the SOI-MEMS integrated process.
� Compliant micro-leverage mechanism design and analysis, FEM analysis and simulation with ABAQUS and SUGAR; Design of the mechanism for force and displacement amplification in other MEMS devices including a micro-valve, an electrostatic actuator and the suspension of the disk drive.
9. Internship, Lawrence Berkeley National Lab, EETD, 6/1999-12/1999.
� Optics programming; SEM and TEM measurements of glass samples.
10. Graduate Researcher, Integrated Engineering and Mechatronics Lab, Dept. of Mechanical and Aeronautical Engineering, UC Davis, 1994-1996
� With Ch program, analysis of velocity and acceleration for 32 spatial mechanisms (4-bar, 5-bar, 6-bar and 7-bar); force and torque analysis of RCCC & RCRCR mechanisms;
� Designed a data acquisition system for PAS machine by communication of an AT-MIO-16F board in Labview.
GRADUATE THESIS ADVISING:
� Yaosong Tao, International Technological University, Ph.D. Thesis: RF MEMS Components for Communication Systems, 2004.
� Leo Huang, Northwestern Polytechnic University, M.S. Thesis, Contacting Printing Lithography for Polymeric Organic Light-Emitting Diode, 2005;
� Sam Shi, International Technological University, M.S. Thesis, A 8-bit Energy Recover Adder, 2005;
� Parthiv Pandya, International Technological University, M.S. Thesis: MRAM Core Cell Design and Optimization, 2004;
� Paisit Sriprataks, International Technological University, M.S. Thesis: MRAM Sensing Circuit Design, 2004;
� Balajee Premraj, International Technological University, M.S. Thesis: Design of an 8M MRAM, 2004;
� Raul Gali, Northwestern Polytechnic University, M.S. Thesis: Signal Process Circuit Design for a Resonant Accelerometer, 2003;
AWARDS and HONORS
� John H. Latoures Scholarship, Mechanical Engineering Department,U.C. Berkeley, 2001.
� Lankershim Awards, U.C. Berkeley, 2000
� National Science Foundation (NSF) Graduate Research Fellowship (1996-1999);
� American Associated University Woman (AAUW) Selected Professional Fellowship ,1995;
� University Fee Grant, UC Davis, 1994.
PUBLICATIONS
1. S. X. P. Su, H. S. Yang, Alice M Agogino, Resonant Accelerometer with a Two-Stage Microleverage Mechanism Fabricated by SOI-MEMS Technology, IEEE Sensors Journal, Vol.5, No.6 December 2005, p.1214-1223
2. An Sang Hou, Susan X. P. Su, Design of a Capacitive-Sensor Signal Processing System with High Accuracy and Short Conversion Time, Sensors and Actuators A: Physical, Volume 119, Issue 1, 28 March 2005, P.113-119
3. X-P S. Su, H. S. Yang, Analytical Modeling and FEM Simulation of Single-Stage Microleverage Mechanism, International Journal of Mechanical Sciences 44, 2217-2238, 2002.
4. X-P. S. Su, H. S. Yang, Two-Stage Microleverage Mechanism Optimization in a Resonant Accelerometer, Structural and Multidisciplinary Optimization 22, 328-336, 2002.
5. X-P S. Su, H. S. Yang, Design of Compliant Microleverage Mechanism, Sensors and Actuators, A 87 146-156, 2001.
6. X-P S. Su, H. S. Yang, Single-Stage Microleverage Mechanism Optimization in a Resonant Accelerometer, Structural and Multidisciplinary Optimization 21, 246-252, 2001
7. H. S. Yang, X-P S. Su and B. Bai, Strain Analysis in Uniaxial Tensile and Compression Testing of Anisotropic Materials, International Journal of Mechanical Sciences 42 (2000) 2395-2415.
PATENTS
1. Susan X. P. Su, �A Folded-MTJ MRAM Cell� U.S. Patent No. US60/994941, 2007
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tonyHK12
04-29 03:38 PM
Then my apologies to Tony.
Sure. I guess most of us would rather worry about such stuff on a weekend, considering our immigration options here.
Sure. I guess most of us would rather worry about such stuff on a weekend, considering our immigration options here.
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06-12 11:10 AM
Is there a link online for that???
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sunny1000
02-08 05:28 PM
I dont see any light at the tunnel. PDs will not move until they allow 485 filing even PD is not current.
Please send the letter to WH if not already. As lasantha said, filing for I-485 when PD is not current is something IV is taking up with the administration. But, we need to get more letters to support our argument that this systemic dysfunction at USCIS is widespread and is affecting tens of thousands of people and not just a mere 1200 (that is the letters total so far and 10% of that comes from needhelp's efforts:))
Please send the letter to WH if not already. As lasantha said, filing for I-485 when PD is not current is something IV is taking up with the administration. But, we need to get more letters to support our argument that this systemic dysfunction at USCIS is widespread and is affecting tens of thousands of people and not just a mere 1200 (that is the letters total so far and 10% of that comes from needhelp's efforts:))
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coopheal
11-06 12:19 PM
Changing to vertical spillover will NOT help EB3 India or China. EB3 ROW is not current and it will suck up all overflow leaving EB2I, EB2C, EB3I and EB3C to their annual quota only. USCIS changing the process to horizontal spillover is the best thing that has happened to I and C community in the absence of immigration reform. Now there is at least some hope for EB3 folks to get a new job and apply in EB2, as at least that queue is faster. If we fight among ourselves and stop vertical spillover, it will only benefit EB3ROW as they will get all overflow from EB1 and EB2ROW. Please guys, let's not fight.
If there is a fire in the house regardless of how you arrange furniture at least some of it will get burnt.
So stop giving advice like these and focus on extinguishing the fire.
If there is a fire in the house regardless of how you arrange furniture at least some of it will get burnt.
So stop giving advice like these and focus on extinguishing the fire.
lvinaykumar
11-26 04:28 AM
Looks like i need to find a new job to file under EB2 :D
texcan
01-11 05:48 PM
1) Try state group insurance
Texas and for that matter every state has a group insurance coverage for folks
who donot get coverage from any other insurance provider.
This is a coverage that you will get for sure, only document you will need is a written paper from insurance company that one cant be insured.
Check the state insurance board website.
2) check free clinics, these clinics will provide complete care ( you can pay them if you like)if you dont thats fine too. I suggest paying them if you can even if its a bit high, as someone who cant afford may one day get to use this service too.
3) Ask yours employer's insurance agent, group insurances gurantee insurance.
Donot worry, life works in interesting ways. As last resort one can go to home country for delivery.
donot worry.
Texas and for that matter every state has a group insurance coverage for folks
who donot get coverage from any other insurance provider.
This is a coverage that you will get for sure, only document you will need is a written paper from insurance company that one cant be insured.
Check the state insurance board website.
2) check free clinics, these clinics will provide complete care ( you can pay them if you like)if you dont thats fine too. I suggest paying them if you can even if its a bit high, as someone who cant afford may one day get to use this service too.
3) Ask yours employer's insurance agent, group insurances gurantee insurance.
Donot worry, life works in interesting ways. As last resort one can go to home country for delivery.
donot worry.
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